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Meeting the growing demand for Atomic Force Metrology in large flat panel displays, Park NX-TSH tip Scan Head adeptly handles nanometrology for samples over 300mm. Its Tip Scanning Head and gantry-style air-bearing stage enable precise roughness, step height, and critical dimension measurements. As a highly accurate and non-destructive method, atomic force microscopy with Park NX-TSH delivers reliable, high-resolution AFM images for OLEDs, LCDs, photomasks, and more.
In the realm of large panel display manufacturing, especially for samples exceeding 300 mm, the need for precise metrology is paramount. This sector faces the challenge of accurately measuring and analyzing nanoscale features on large substrates, a task crucial for ensuring the quality and performance of final products like OLEDs and LCDs. Park Systems responds to this challenge with specialized AFM for large panel scanning.
Using conductive AFM, Park NX-TSH can measure the sample surface with optional probe stations that contact the sample surface and provide current into small devices or chips of wafer level. Park NX-TSH is for a 2D encoder sample with conductive AFM for electric defect analysis by integrating micro probe stations.
Park NX-TSH system is tailored for analyzing large samples such as those found in OLED, LCD, and other flat panel displays. It has been specifically scaled up to accommodate Gen8+ and all large flat panel displays, offering a comprehensive solution for the industry's needs. Designed to handle heavy flat panel display glass and 2D encoders, the Park NX-TSH integrates microprobe stations for conductive AFM and electric defect analysis. With scanning capabilities of up to 100 µm x 100 µm (x-y direction) and 15 µm (z-direction), it provides precise and detailed measurements over a wide range. Additionally, its flexible chuck can accommodate samples larger than 300 mm, ensuring versatility and efficiency in large sample analysis applications.
Park NX-TSH tip scanning head system offers enhanced flexibility and precision for manufacturers involved in producing next-generation flat panel displays. By fixing the sample onto a chuck and employing a gantry-mounted tip scanning head, it effectively overcomes limitations related to sample size and weight. Developed specifically to address the challenges faced by fabs striving to surpass the 300 mm threshold limit, the Park NX-TSH provides a comprehensive solution. With the capability for conductive AFM, it enables precise measurement of sample surfaces, further enhanced by optional probe stations that facilitate current provision into devices on the wafer.