Revolutionizing photomask repair, the Park NX-Mask system addresses the challenges of shrinking device sizes and increasing photomask complexity with its advanced AFM technology. It precisely removes defects without the damage risks associated with E-beam or laser systems, maintaining the integrity of the reflective surface and patterns. With a unique depth control of ±7.5 µm, NX-Mask efficiently handles various defect types and integrates smoothly into in-line processes for quick repairs.
Photomask repair is crucial in the semiconductor industry for fixing defects from EUV lithography, which hinder precise imprinting. Traditional repair methods like E-Beam or Laser risk damaging the EUV mask's fine patterns due to beam size limitations. Moreover, the lack of automation in these systems complicates their integration into in-line processes. Park Systems addresses these challenges with its advanced AFM photomask repair technology, providing a comprehensive solution for automated defect review, non-damaging repair, and repair verification, thereby enhancing repair efficiency and throughput.
Photomask defects are a result from foreign particles in the environment or by erroneous pattern processing. The most commonly found defects on high-end photomasks are tin particles generated during the EUV lithography process. The AFM nanomechanical method of Park NX-Mask offers many advantages that are superior and completely safe for photomask repairs.
Debris such as tin (Sn) particles from an EUV light source may reach the photomask and reduce light reflectivity. Park NX-Mask utilizes its proven nano-mechanical AFM technology to find and remove extraneous particles and the complexity of pattern defects in a completely safe manner. Unlike conventional photomask repair systems, Park NX-Mask executes the repair without causing any damage or perturbing the mask surface.
Park NX-Mask presents optimized solutions tailored for inline production, featuring an automated dual pod design specifically engineered for handling EUV masks. Utilizing AFM technology, it ensures seamless repair of any defect type, offering an all-in-one solution encompassing automatic defect review, defect repair, and verification of the repair process. Moreover, its automated dual pod design streamlines the handling of EUV masks in an inline production environment, enhancing efficiency and precision throughout the process.
Park NX-Mask first performs a survey scan to locate the defects using its proprietary non-contact AFM technology which offers the safest method of scanning. From the survey scan, Park NX-Mask learns the quantity and precise location of the defects, and information on each of those particles and faults. Following the repair, Park NX-Mask employs our non-contact AFM technology to conduct post-repair verification, generating nanoscale 3D topography and other critical metrology data such as surface roughness.