NX-3DM

Park NX-3DM

Automated Industrial AFM for High-Resolution 3D Metrology

The innovative Park 3DM, an automated AFM system, excels in overhang profiles, sidewall imaging, and critical angle measurements with its unique decoupled XY and Z scanning and a tilted Z-scanner. It effectively addresses the limitations of normal and flare tip methods in sidewall analysis. The system's True Non-Contact Mode™ allows for non-destructive measurement of soft photoresist surfaces using high aspect ratio tips.

Park NX-Wafer Operation Process

Applications

Innovation and Efficiency for 3D Metrology

Park Systems Automated AFMs are engineered to excel wafer processing metrology, offering a precise toolset for critical measurements and analysis tasks. These advanced systems facilitate the detailed metrology required in semiconductor wafer processing, providing consistent, accurate, and extensive data that supports improved manufacturing processes and product quality. Designed to integrate seamlessly with existing processing lines, they deliver a robust solution for semiconductor production engineering and quality assurance.

Automatic Defect Review for Bare Wafers and Substrates

The new 300 mm bare wafer ADR provides a fully automated defect review process from transfer and alignment of defect maps to the survey and zoom-in scan imaging of defects that uses a unique remapping process that does not require any reference marker on a sample wafer. Unlike SEM which leaves square-shaped destructive irradiation marks on defect sites after its run, the new Park ADR AFM enables advanced coordinate translation with enhanced vision that uses the wafer edge and notch to automatically enable linkage between a defect inspection tool and the AFM. Since it is fully automated, it does not require any separate steps to calibrate the stage of the targeted defect inspection system, increasing throughput by up to 1,000%.

Critical Dimension Measurement

The True Non-contact mode enables instrument and subject-preserving CD measurement without sacrificing image fidelity.

Sidewall Roughness Measurement

The NX-3DM’s innovative head tilting design allows access to the sidewalls using an ultra sharp tip to obtain high resolution, well-defined details of the area and its roughness. Innovative head tilting design allows access to the sidewalls using ultra sharp tip to obtain high resolution and(more defined)details of the side wall roughness.

Key Features

Full Automation

Park NX-3DM is a clean-room-compatible, fully automated nanoscale measurement and analysis system that utilizes NX technology to construct highly accurate topographical images and gather crucial dimensional data. Its industry-leading low noise Z-detector operates on an independent, closed loop to minimize errors in topography, mitigating the "creep effect." With its True Non-contact™ mode, it enables the collection of high-resolution and precise data without risking tip-sample damage, thereby saving valuable time and resources that could otherwise be lost to costly repairs or adjustments.

Innovative Head Design

The Z-head's distinctive sideways orientation in Park NX-3DM facilitates access to undercut and overhang structures in materials like photoresist, while its patented decoupled XY and Z scanning systems, coupled with the tilted Z-scanner, empower users to overcome challenges in accurate sidewall analysis typically associated with conventional methods. This system enables measurement of sidewall trench line profiles, roughness, critical angle, and critical dimensions. Moreover, the Z-head's tilting mechanism facilitates access to sidewalls using an ultra-sharp tip, ensuring the same high resolution and definition obtained over the rest of the material

Seamless 3D Material Measurement

In the process facilitated by Park NX-3DM, no sample preparation such as cutting, mounting, or coating is necessary to obtain measurements of sidewall roughness or critical dimensions. This efficiency is achieved through the utilization of Z-head tilting and True Non-contact™ mode, enabling both tip-preserving and high-resolution collection of sidewall data.

Applications

Perfect for Diverse Applications